Chiplets increase performance, scalability, and cost efficiency for AI applications

Chiplet Summit announces its fourth annual conference on February 17-19, 2026, at the Santa Clara Convention Center. The 2026 event will highlight the next wave of innovation in chiplet-based design and integration, focusing on advanced packaging, die-to-die interfaces, and AI acceleration. Attendees will explore how chiplets enable faster design cycles, higher yields, and more powerful systems at lower cost. The event also covers high-bandwidth memory, a low-cost way to create a supercomputer-in-a-package that can support generative AI.

This year’s Summit features major vendor keynotes, expert tables, and technology and market updates. It also offers sessions on the open chiplet economy, die-to-die interfaces, and working with foundries. Designers will learn to develop leading-edge chips at low cost. An exhibit area will showcase the latest tools, technologies and chiplet-enabled solutions.

“Chiplets allow system designers to implement the latest process nodes and packaging methods to implement AI applications. They also offer more flexibility, faster updates, and higher performance per watt,” said Chuck Sobey, Summit General Chair. “The 2026 Summit lets experts across the ecosystem address packaging challenges and extend the chiplet revolution.”

“Chiplet Summit has quickly become the go-to event for design and packaging engineers. It has more than doubled attendance every year and greatly increased its exhibits. Now, with keynotes from Synopsys, Cadence, Siemens EDA, Alphawave Semi, Marvell, UCIe Consortium, Arm, and Open Compute Project, it has advanced the conversation and united leaders who are shaping the future of chip design.” – Lance Leventhal, Program Chair, Chiplet Summit.

About Chiplet Summit

Chiplet Summit is a technical conference that showcases the emerging chiplet market. The event features the innovators and companies using chiplets in designs for processors, memories, communications chips, and AI devices. Chiplet Summit is a product of Semper Technologies. For more information, visit www.chipletsummit.com.

View source version on businesswire.com: https://www.businesswire.com/news/home/20251118021495/en/

“Chiplet Summit has quickly become the go-to event for design and packaging engineers. It has more than doubled attendance every year and greatly increased its exhibits." -- Lance Leventhal, Program Chair