1934 Act Registration No. 1-14700
SECURITIES AND EXCHANGE COMMISSION
Washington, DC 20549
FORM 6-K
REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 OF
THE SECURITIES EXCHANGE ACT OF 1934
For the month of December 2002
Taiwan Semiconductor Manufacturing Company Ltd.
(Translation of Registrant's Name Into English)
No.121 Park Avenue III
Science-Based Industrial Park
Hsin-chu, Taiwan
(Address of Principal Executive Offices)
(Indicate by check mark whether the registrant files or will file annual
reports under cover of Form 20-F or Form 40-F.)
Form 20-F V Form 40-F ________
-------
(Indicate by check mark whether the registrant by furnishing the
information contained in this form is also thereby furnishing the information to
the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of
1934.)
Yes _________ No V
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(If "Yes" is marked, indicated below the file number assigned to the registrant
in connection with Rule 12g3-2(b): 82: _______.)
TSMC EXPANDS ADVANCED TECHNOLOGY LIBRARIES, ENHANCES DISTRIBUTION PROGRAM TO
ACCELLERATE AVAILABILITY
Distribution Strategy Creates an Integrated Design Chain
while Improving Designers' Library Choices
Hsinchu, Taiwan, December 10, 2002 - Taiwan Semiconductor Manufacturing Company
(NYSE: TSM) today announced the expansion of its library service by adding new
classes of libraries for advanced product design and widening the distribution
and support channel. The new library program provides both third-party and
TSMC-developed libraries, which are tuned for a variety of process technologies
including TSMC's most advanced Nexsys(SM)90 nanometer process for
system-on-chip(SoC) design.
Under this new program, TSMC-brand I/O and standard cell libraries will be
distributed by multiple third-party library and EDA tool partners, greatly
enhancing customer service and support. Three generations of technology, i.e.,
0.15-micron, 0.13-micron and 90nm, are covered by the new line of libraries.
Also, the collaboration with EDA tools developers in this distribution/support
program creates an integrated design chain that is expected to provide
heightened levels of synergy, value-add and technical service to designers. As a
result, this program will offer the widest variety of libraries in the industry
including standard cell, I/O and memory tailored to TSMC's process technology.
Multiple distribution and service partners of this program will be revealed in
the next few weeks.
The first distribution partner under this new program is Virage Logic. This
new arrangement allows Virage to offer a complete line of libraries (standard
cell, I/O and memory). At the same time, the market enjoys better and more
convenient services from Virage as a new comprehensive library distribution and
service provider.
"Due to the complexity of advanced process technology and the attendant
technical trade-offs to density, speed and power, there is no so-called optimal
library that suits all the various applications areas, such as high speed GPUs
or handheld PDAs," said TSMC Ed Chen, director of design & e-service, marketing
division. "By providing multiple libraries, each optimized for different
trade-offs, we can serve the design community far better."
TSMC Expanded Library Distribution and Service
TSMC's new library program provides a comprehensive, broadly available
portfolio of both TSMC and third-party libraries that complement each other. The
TSMC-branded libraries were developed synergistically by its internal R&D
organization. The third-party libraries from library vendors such as Virage
Logic and Artisan Components are concurrently developed with the TSMC's industry
leading process technologies and verified through TSMC9000 qualification
procedure. The expanded library service allows designers to enjoy more libraries
each uniquely positioned for the target application and to receive better
services due to the multiple providers.
TSMC Nexsys 90nm Libraries
TSMC's Nexsys 90nm libraries include standard cells and I/O cells with
features for system-on-chip design, such as Dual-Threshold Power Tuning, which
allows designers to integrate high-speed and low-leakage functionality on the
same chip. The result is a new set of libraries that offers up to 50%
performance improvement with half the area and half of the power consumption
compared to 0.13-micron library.
"With the Nexsys 90nm library, TSMC is opening a door that has never been
opened before, one that leads directly into our Research and Development
programs for the most advanced process technologies in the industry," said Dr.
Ping Yang, vice president of R&D at TSMC. "It provides designers with real tools
that can be applied to advanced systems design, even as the processes are being
developed. This is a powerful expansion of our partners' service offerings, as
well as a new model for the distribution of TSMC-brand, process-tuned standard
cell and I/O technology libraries."
About TSMC
TSMC is the world's largest dedicated semiconductor foundry, providing the
industry's leading process technology and the foundry industry's largest
portfolio of process-proven library, IP, design tools and reference flows. The
company operates one advanced 300mm wafer fab, five eight-inch fabs and one
six-inch wafer fab. TSMC also has substantial capacity commitments at two joint
ventures fabs (Vanguard and SSMC) and at its wholly-owned subsidiary, WaferTech.
In early 2001, TSMC became the first IC manufacturer to announce a 90-nanometer
technology alignment program with its customers. TSMC's corporate headquarters
are in Hsin-Chu, Taiwan. For more information about TSMC to http://www.tsmc.com.
# # #
TSMC Spokesperson:
-----------------
Mr. Harvey Chang
Senior Vice President
Tel: 886-3-578-0221 Ext. 2075
For further information, please contact:
---------------------------------------
Mr. J.H. Tzeng Mr. Jesse Chou Ms. Shan-Shan Guo
PR Department Manager, TSMC Public Affairs Manager, TSMC PR Manager, TSMC
Tel: 886-3-567-3338 Tel:886-3-5673347 (O) Tel:886-3-5673345(O)
886-928-882-607(Mobile) 886-932-113-258(Mobile) 886-939-059-246 (Mobile)
Fax: 886-3-567-0121 Fax:03-5670121 Fax:03-5670121
E-mail: jhtzeng@tsmc.com.tw E-Mail:jhchoua@tsmc.com.tw Email: ssguo@tsmc.com.tw
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Taiwan Semiconductor Manufacturing Company Limited
For the month of December 2002
This is to report 1) the trading of directors, supervisors, executive officers
and 10% shareholders of Taiwan Semiconductor Manufacturing Company Ltd. (The
Company; "TSMC") (NYSE:TSM) 2) the pledge and clear of pledge of TSMC common
shares by directors, supervisors, executive officers and 5% shareholders of TSMC
3) the acquisition of assets by TSMC and 4) the disposition of assets by TSMC
for the month of November 2002.
1)The trading of directors, supervisors, executive officers and 10% shareholders:
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Number of shares held
when elected (for
Title Name Directors, Supervisors Number of Number of
and Executive Officers) Shares held as Shares held as
or as April 14, 2000 (for October 31, November 30, Changes
10% shareholders) 2002 2002
---------------------------------------------------------------------------------------------------------------------------------
President Rick Tsai 20,059,738 19,869,738 -190,000
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Vice President Harvey Chang 6,444,499 6,404,499 -40,000
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Vice President C. C. Wei 3,844,322 3,655,322 -189,000
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Vice President Mark Liu 8,104,370 8,044,370 -60,000
---------------------------------------------------------------------------------------------------------------------------------
Vice President Genda Hu 884,508 866,508 -18,000
---------------------------------------------------------------------------------------------------------------------------------
Vice President Chung-Shin Hsu 797,077 778,782 -18,295
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Vice President Kenneth Kin 1,618,172 1,568,172 -50,000
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/1./ The Philips Electronics, B.V. appoints 3 directors and 1 supervisor.
/2./ The Development Fund appoints 1 director and 1 supervisor.
2) The pledge and clear of pledge of TSMC common shares by directors,
supervisors, executive officers and 10% shareholders: None.
3) The acquisition of assets: (Unit:$Thousand)
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Description of assets Purchase price
--------------------------------------------------------------------------------
Semiconductor Manufacturing Equipment NT$493,444
--------------------------------------------------------------------------------
Operational Facility NT$303,215
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Common Shares of Ya-Xin Technology co., Ltd. NT$341,250
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4) The disposition of assets: (Unit:$Thousand): None.
SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the
registrant has duly caused this report to be signed on its behalf by the
undersigned, thereunto duly authorized.
Taiwan Semiconductor Manufacturing Company Ltd.
Date: December 24, 2002 By /s/ Harvey Chang
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Harvey Chang
Senior Vice President & Chief Financial Officer