1934 Act Registration No. 1-15128
SECURITIES AND EXCHANGE COMMISSION
Washington, DC 20549
FORM 6-K
REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 OF
THE SECURITIES EXCHANGE ACT OF 1934
Dated April 15, 2003
For the month of March 2003
United Microelectronics Corporation
(Translation of Registrant's Name into English)
No. 3 Li Hsin Road II
Science-Based Industrial Park
Hsinchu, Taiwan, R.O.C.
(Address of Principal Executive Office)
(Indicate by check mark whether the registrant files or will file annual
reports under cover of form 20-F or Form 40-F.)
Form 20-F X Form 40-F
------- ----------
(Indicate by check mark whether the registrant by furnishing the information
contained in this form is also thereby furnishing the information to the
Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of
1934.)
Yes No X
-------- --------
(If "Yes" is marked, indicated below the file number assigned to the
registrant in connection with Rule 12g3-2(b): Not applicable )
--------------
This current report on Form 6-K is hereby incorporated by reference into our
Registration Statement on Form F-3 filed with the Commission on January 2, 2002,
as amended (File No.333-14256).
SIGNATURE
Pursuant to the requirements of the Securities Exchange Act of 1934, the
registrant has duly caused this report to be signed on its behalf by the
undersigned, thereunto duly authorized.
United Microelectronics Corporation
Date: 4/15/2003 By /s/ Stan Hung
-------- ------ --------------------------------
Stan Hung
Chief Financial Officer
Exhibit
Exhibit Description
99.1 Announcement on Mar 13, 2003: To announce related materials on more
than NTD 300,000,000 in accumulated amount has been spent on the
Company shares repurchase
99.2 Announcement on Mar 15, 2003: 1) the trading and pledge of UMC
common shares by directors, supervisors, executive officers and 10%
shareholders of UMC 2) the acquisition and disposition of assets by
UMC
99.3 Announcement on Mar 19, 2003: To announce related materials on
acquisition of Silicon Integrated Systems Corporation securities
99.4 Announcement on Mar 20, 2003: Impacts of assumed US-Iraq war on the
Company's financial and business situation
99.5 Announcement on Mar 21, 2003: To announce related materials on more
than NTD 300,000,000 in accumulated amount has been spent on the
Company shares repurchase
99.6 Announcement on Mar 25, 2003: Important Resolutions Approved from
8th term,21st Board Meeting
99.7 Announcement on Mar 25, 2003: Board Meeting Approved a Resolution
for New Shares Issuance
99.8 Announcement on Mar 25, 2003: Board Meeting's Resolution on
Retained Earning Distribution
99.9 Announcement on Mar 25, 2003: Board's Resolution to Convene Annual
General Meeting (AGM)
99.10 Announcement on Mar 25, 2003: To announce related materials on more
than NTD 300,000,000 in accumulated amount has been spent on the
Company shares repurchase
99.11 Announcement on Mar 27, 2003: UMC Forms Strategic Partnership with
Silicon7
99.12 Announcement on Mar 27, 2003: To announce related materials on more
than NTD 300,000,000 in accumulated amount has been spent on the
Company shares repurchase
99.13 Announcement on Mar 27, 2003: To announce related materials on
acquisition of Silicon Integrated Systems Corporation securities
99.14 Announcement on Mar 28, 2003: UMC Honors Xilinx for Milestone
Achievement:300mm Volume Manufacturing on Advanced Technologies
99.15 Announcement on Mar 31, 2003: UMC Delivering Customer IC's Built on
90nm Technology
99.16 Announcement on April 2, 2003: Oki and UMC/UMCJ Achieve New
Production
99.17 Announcement on April 8, 2003: Giga Solution, Mentor Graphics
and UMC Release Foundry Design Kits for 0.18um RF Mixed-Mode Process
99.18 Announcement on April 10, 2003: March Sales
99.19 Announcement on April 11, 2003: The Board of Directors of the
Company decides to issue unsecured corporate bonds
99.20 Announcement on April 15, 2003: 1) the trading and pledge of UMC
common shares by directors, supervisors, executive officers and 10%
shareholders of UMC 2) the acquisition and disposition of assets by
UMC
Exhibit 99.1
To announce related materials on more than NTD 300,000,000 in accumulated amount
has been spent on the Company shares repurchase
1. Date the cumulative number of shares repurchased in the current repurchase
accounted for 2 percent or more of the shares issued by the company or the
cumulative value of shares repurchased amounted to NT$300 million or
more:2003/03/13
2. Number of shares repurchased this time:15,800,000 shares
3. Type of shares repurchased this time:common stock
4. Total monetary amount of shares repurchased this time:NTD 307,457,465
5. Average repurchase price per share this time:NTD 19.46
6. Cumulative number of own shares held during the repurchase period: 15,800,000
shares
7. Ratio of cumulative number of own shares held during the repurchase period to
the total number of the Company's issued shares:0.1%
8. Any other matters that need to be specified:None
Exhibit 99.2
United Microelectronics Corporation
For the month of February, 2003
This is to report 1) the trading of directors, supervisors, executive officers
and 10% shareholders of United Microelectronics Corporation ("UMC") (NYSE : UMC)
2) the pledge and clear of pledge of UMC common shares by directors,
supervisors, executive officers and 10% shareholders of UMC 3) the acquisition
assets by UMC 4) the disposition of assets by UMC for the month of February,
2003
1) The trading of directors, supervisors, executive officers and 10%
shareholders
Title Name Number of shares held Number of shares Number of shares Changes
when elected (for held as of held as of
Directors, December 31, 2002 February 28, 2003
Supervisors and
Executive Officers)
or as May 30, 2001
N/A N/A
2) The pledge and clear of pledge of UMC common shares by directors,
supervisors, executive officers and 10% shareholders :
Title Name Number of Number of Changes
shares pledge shares pledge
as of as of
December 31, February 28,,
2002 2003
N/A N/A
3) The acquisition assets (NT$ Thousand)
Description of assets February Jan -Feb
Semiconductor Manufacturing Equipment 269,728 921,767
Fixed assets 8,679 9,460
4) The disposition of assets (NT$ Thousand)
Description of assets February Jan -Feb
Semiconductor Manufacturing Equipment 111,184 111,620
Fixed assets 0 0
Exhibit 99.3
To announce related materials on acquisition of Silicon Integrated Systems
Corporation securities
1. Name of the security:common shares of Silicon Integrated Systems Corp.
2. Trading date:2003/03/06~2003/03/19
3. Trading volume, unit price, and total monetary amount of the transaction:
trading volume:4,376,000 units;unit price:NTD$25.69;total amount:
NTD$112,427,104
4. Gain (or loss) on disposal (not applicable in cases of acquisition of
securities):not applicable
5. Relationship with the underlying company of the trade:Silicon Integrated
Systems Corp.,investee company under equity method
6. Current cumulative volume, amount, and shareholding percentage of holdings of
the security being traded (including the current trade) and status of
restriction of rights:cumulative volume:71,831,000 units;amount:
NTD1,944,349,714; percentage of holdings:5.37%; status of restriction of
rights:no
7. Current ratio of long or short term securities investment (including the
current trade) to the total assets and shareholder's equity as shown in the
most recent financial statement and the operational capital as shown in the
most recent financial statement:ratio of total assets:21.19%; ratio of
shareholder's equity:29.41%; the operational capital as shown in the most
recent financial statement:$61,639,615 thousand NTD
8. Concrete purpose/objective of the acquisition or disposal:long-term
investment
9. Opinions of directors expressing opposition to the current trade:none
10.Any other matters that need to be specified:none
Exhibit 99.4
Impacts of assumed US-Iraq war on the Company's financial and business situation
1. Date of occurrence of the event:2003/03/20
2. Cause of occurrence:The assumed US-Iraq war currently has no impact on the
Company's financial and business situation
3. Countermeasures:None
4. Any other matters that need to be specified:The Company will make
announcements on impacts and management measures if any further development.
Exhibit 99.5
To announce related materials on more than NTD 300,000,000 in accumulated amount
has been spenton the Company shares repurchase
1. Date the cumulative number of shares repurchased in the current repurchase
accounted for 2 percent or more of the shares issued by the company or the
cumulative value of shares repurchased amounted to NT$300 million or
more:2003/03/21
2. Number of shares repurchased this time:18,650,000 shares
3. Type of shares repurchased this time:common stock
4. Total monetary amount of shares repurchased this time:NTD 400,841,980
5. Average repurchase price per share this time:NTD 21.49
6. Cumulative number of own shares held during the repurchase period: 34,450,000
shares
7. Ratio of cumulative number of own shares held during the repurchase period to
the total number of the Company's issued shares:0.22%
8. Any other matters that need to be specified:None
Exhibit 99.6
Important Resolutions Approved from 8th term,21st Board Meeting
1. Date of occurrence of the event:2003/03/25
2. Cause of occurrence:n/a
3. Countermeasures:n/a
4. Any other matters that need to be specified:
(1) The Company's revenue for 2002 is NT$67,425,745 thousand, net income
after tax is NT$7,072,032 thousand, EPS is NT$0.48
(2) Proposal to pay a stock dividend: to issue a stock dividend of 40 common
shares for every 1,000 common shares
(3) Approved amendment of the Company's Article of Incorporation No.2 and
No.25
(4) 2003 annual general meeting (AGM) will be held at 9:30am on June 9, 2003
in the Auditorium of Activity Center, Hsinchu Science-Based Industrial
Park
Exhibit 99.7
Board Meeting Approved a Resolution for New Shares Issuance
1. Date of the board of directors resolution:2003/03/25
2. Source of capital increase funds:undistributed retained earnings from 2002
and before
3. Number of shares issued:665,897,817 shares (including employee bonus shares)
4. Par value per share:NT$10
5. Total monetary amount of the issue:NT$6,658,978,170
6. Issue price:n/a
7. Number of shares subscribed by or allotted to employees:57,972,672 shares for
employee bonus
8. Number of shares publicly sold:n/a
9. Ratio of shares subscribed by or allotted as stock dividends to existing
shareholders:each shareholder will be entitled to receive a stock
dividend of 40 shares for every 1,000 common shares held by shareholders.
10.Method of handling fractional shares and shares unsubscribed by the deadline:
if received shares include any fractional shares which are less than one
share, shareholders may arrange fractional shares to form one full share and
register within 5 days of the record date. Otherwise cash will be paid in the
amount calculated at par value and Chairman will be authorized to arrange
designated parties to purchase fractional shares.
11.Rights and obligations of the newly issued shares:same as oridnary shares
12.Utilization of the funds from the capital increase:investment and expansion
project
13.Any other matters that need to be specified:none
Exhibit 99.8
Board Meeting's Resolution on Retained Earning Distribution
1. Date of the board of directors resolution:2003/03/25
2. Type and monetary amount of dividend distribution:stock dividend
NT$6,079,251,450
3. Any other matters that need to be specified:
(1) Propose to distribute employee bonus shares NT$579,726,720, bonus
to directors & supervisors is NT$5,803,914
(2) Propose to issue 57,972,672 shares as employee bonuses, which account for
8.71% of total new shares issuance
(3) Recalculated EPS after distributions of employee bonuses and directors &
supervisors bonuses is NT$0.44
Exhibit 99.9
Board's Resolution to Convene Annual General Meeting (AGM)
1. Date of the board of directors resolution:2003/03/25
2. Date for convening the shareholders' meeting:2003/06/09
3. Location for convening the shareholders' meeting:The Auditorium in the
Activity Center of Hsinchu Science-Based Industrial Park
4. Cause or subjects for convening the meeting:
(1) Reporting items
(2) To accept the Company's 2002 business report and financial statement
(3) To approve the Company's 2002 retained earnings distribution
(4) To approve the amendment on the procedure of acquisition or disposal of
assets
(5) To approve the amendment of the Company's "Endorsements and Guarantees
Method", and change its title to "Endorsements and Guarantees Procedures"
(6) To approve the amendment of the Company's "Loan Procedures"
(7) To approve the amendment of the Company's "Financial Derivatives
Transactions Procedures"
(8) To approve allowing the Company's director, John Hsuan, to serve as a
director of the company that is competing in the same or similar industry as
UMC
(9) To approve the capitalization of retained earings
(10)To approve the amendment to the Comapny's Articles of Incorporation
(11)Other agenda and special motions
5. Starting and ending dates of suspension of share transfer:2003/04/11~
2003/06/09
6. Any other matters that need to be specified:none
Exhibit 99.10
To announce related materials on more than NTD 300,000,000 in accumulated amount
has been spent on the Company shares repurchase
1. Date the cumulative number of shares repurchased in the current repurchase
accounted for 2 percent or more of the shares issued by the company or the
cumulative value of shares repurchased amounted to NT$300 million or
more:2003/03/25
2. Number of shares repurchased this time:19,000,000 shares
3. Type of shares repurchased this time:common stock
4. Total monetary amount of shares repurchased this time:NTD 404,795,928
5. Average repurchase price per share this time:NTD 21.31
6. Cumulative number of own shares held during the repurchase period:
53,450,000 shares
7. Ratio of cumulative number of own shares held during the repurchase period
to the total number of the Company's issued shares:0.35%
8. Any other matters that need to be specified:None
Exhibit 99.11
UMC Forms Strategic Partnership with Silicon7
1. Date of occurrence of the event:2003/03/27
2. Cause of occurrence:Hsinchu, Taiwan, and Seoul, South Korea--UMC (NYSE: UMC),
a world leading semiconductor foundry, and cutting edge memory design house,
Silicon7, today announced the completion of a strategic investment to form a
partnership aimed at providing advanced, cost-effective memory products for
the growing mobile handset and communications markets. John Hsuan,
vice-chairman of UMC, was also appointed to Silicon7's board of directors.
UMC and Silicon7 have been cooperating for a number of years on the
development and manufacturing of memory products that target the mobile
communications market space. Silicon7's Compact Cell SRAM products are in
volume production at UMC and deliver the low cost, low power and high
performance that are required by today's advanced mobile computing and
portable communications devices.
3. Countermeasures:none
4. Any other matters that need to be specified:none
Exhibit 99.12
To announce related materials on more than NTD 300,000,000 in accumulated amount
has been spenton the Company shares repurchase
1. Date the cumulative number of shares repurchased in the current repurchase
accounted for 2 percent or more of the shares issued by the company or the
cumulative value of shares repurchased amounted to NT$300 million or
more:2003/03/27
2. Number of shares repurchased this time:31,000,000 shares
3. Type of shares repurchased this time:common stock
4. Total monetary amount of shares repurchased this time:NTD 644,580,192
5. Average repurchase price per share this time:NTD 20.79
6. Cumulative number of own shares held during the repurchase period:
84,450,000 shares
7. Ratio of cumulative number of own shares held during the repurchase period
to the total number of the Company's issued shares:0.55%
8. Any other matters that need to be specified:None
Exhibit 99.13
To announce related materials on acquisition of Silicon Integrated Systems
Corporation securities
1. Name of the security:common shares of Silicon Integrated Systems Corp.
2. Trading date:2003/03/20~2003/03/27
3. Trading volume, unit price, and total monetary amount of the transaction:
trading volume:4,305,000 units;unit price:NTD$25.13;total amount:
NTD$108,168,950
4. Gain (or loss) on disposal (not applicable in cases of acquisition of
securities):not applicable
5. Relationship with the underlying company of the trade:Silicon Integrated
Systems Corp.,investee company under equity method
6. Current cumulative volume, amount, and shareholding percentage of holdings
of the security being traded (including the current trade) and status of
restriction of rights:cumulative volume:76,136,000 units;amount:
NTD2,052,518,664; percentage of holdings:5.69%; status of restriction of
rights:no
7. Current ratio of long or short term securities investment (including the
current trade) to the total assets and shareholder's equity as shown in the
most recent financial statement and the operational capital as shown in the
most recent financial statement:ratio of total assets:20.28%; ratio of
shareholder's equity:28.15%; the operational capital as shown in the most
recent financial statement:$61,639,615 thousand NTD
8. Concrete purpose/objective of the acquisition or disposal:long-term
investment
9. Opinions of directors expressing opposition to the current trade:none
10. Any other matters that need to be specified:none
Exhibit 99.14
UMC Honors Xilinx for Milestone Achievement:300mm Volume Manufacturing on
Advanced Technologies
1. Date of occurrence of the event:2003/03/27
2. Cause of occurrence:Hsinchu, Taiwan, March 27, 2003 -- UMC (NYSE: UMC, TSE:
2303),a world leading semiconductor foundry, today announced that the
company has granted Xilinx Inc. (NASDAQ: XLNX) a Customer Appreciation Award
for achieving key manufacturing milestones in the semiconductor industry:
volume production of all advanced FPGA product lines on 300mm wafers using
0.13 and 0.15-micron process technology.
The award commemorates the significance of this industry achievement to both
UMC and Xilinx. Xilinx is one of the highest volume purchasers of 300mm
wafers in the world and the world's leading programmable logic solutions
company with more than 60 percent FPGA market segment share. The industry's
most advanced FPGA product line - the Xilinx 0.13 Virtex-II Pro family - is
in production at Fab 12A (Tainan, Taiwan), with excellent yields. By
standardizing on 300mm wafers, Xilinx is delivering the maximum cost
efficiencies to its customers by producing approximately 2.5 times as many
devices per wafer compared to 200mm wafers. Additional Xilinx product
families produced in volume by UMC are: Virtex-E, Virtex-II, Virtex-II Pro
and Spartan-IIE FPGAs.
UMC is currently in volume production for a variety of 0.13um products
targeting a wide range of applications, and is currently migrating more of
these designs to 300mm wafer manufacturing. Revenues from 0.13um technology
were 6% of total sales at the end of 2002.
3. Countermeasures:none
4. Any other matters that need to be specified:none
Exhibit 99.15
UMC Delivering Customer IC's Built on 90nm Technology
1. Date of occurrence of the event:2003/03/31
2. Cause of occurrence:Hsinchu, Taiwan, March 31, 2003 -- UMC (NYSE: UMC; TSE:
2303), a world leading semiconductor foundry, today announced that it is
shipping customer products based on its 90nm (0.09-um) logic process, making
UMC the first dedicated foundry company to announce the delivery of working
customer IC's built on the industry's most advanced manufacturing technology
UMC is the first foundry to achieve this significant milestone, signifying
the tremendous progress it has made on its most advanced process offering
over recent months. UMC expects to move customer wafers to volume production
later this year.
UMC's extensive experience at the 0.13-um generation has helped smooth the
transition to 90nm pilot production. Many of the materials and techniques
that were first introduced at the 0.13um generation also apply to 90nm,
including copper interconnects and low-k dielectric materials. UMC's 90nm
process pushes the technology envelope by incorporating up to 9 copper metal
layers, triple gate oxide and other advanced features. Companies demanding
ultimate performance, density, and power consumption in the fields of
computing, communications and consumer electronics will benefit from UMC's
progress in 90nm manufacturing technology development.
3. Countermeasures:none
4. Any other matters that need to be specified:none
Exhibit 99.16
Oki and UMC/UMCJ Achieve New Production
1. Date of occurrence of the event:2003/04/02
2. Cause of occurrence:TOKYO, Japan-- Oki Electric Industry Co., Ltd.
(TSE 6703), Japan's leading electronics manufacturing company, and world
leading semiconductor foundry UMC (NYSE UMC) today celebrated UMC's
production of 50,000 wafers and reaching 10,000 wafers per month production
for Oki. The announcement was made during a high level meeting held at Oki's
worldwide headquarters. The two companies announced a strategic foundry
partnership in September 2002 and have since rapidly ramped to high volume
production for Oki's LSI products.
3. Countermeasures:none
4. Any other matters that need to be specified:none
Exhibit 99.17
Giga Solution, Mentor Graphics and UMC Release Foundry Design Kits for 0.18um RF
Mixed-Mode Process
1. Date of occurrence of the event:2003/04/08
2. Cause of occurrence:HSINCHU, Taiwan - Giga Solution, the leading RF services
company; Mentor Graphics (NASD: MENT), a world leader in electronic hardware
and software design solutions; and UMC (NYSE: UMC), a world leading
semiconductor foundry, announced today the immediate availability of radio
frequency (RF) and mixed-mode foundry design kits (FDKs) for UMC's 0.18um
process technology. A direct result of a three-way collaboration between the
industry leaders, these fully-tested FDKs, integrating Giga Solution's
silicon proven RF component library and friendly-user interface, enable
quick ramp-up on Mentor's integrated, mixed-signal system on a chip (SoC)
design flow, in turn increasing productivity and speeding time to market.
The 0.18um mixed-mode/RF CMOS FDK is implemented by Giga Solution ready for
production design on a Mentor-based design flow. This FDK with a symbolized
user interface supports schematic symbols, two-way call-back function, Eldo
simulation models, process definition files, device generators, Calibre
DRC/LVS, Calibre xRC LPE, and all other configuration files needed to
effectively utilize Mentor's comprehensive mixed-signal SoC design flow. For
the highly competitive wireless communication market, RF/mixed-mode SoC
designers can easily design the most optimized circuits in the shortest
possible time with this total solution. The 0.13um Mixed-mode CMOS FDK will
be released later this year.
3. Countermeasures:none
4. Any other matters that need to be specified:none
Exhibit 99.18
United Microelectronics Corporation
April 10, 2003
This is to report the changes or status of 1) Sales volume 2) Funds lent to
other parties 3) Endorsements and guarantees 4) Financial derivative
transactions for the period of March 2003
5) Sales volume (NT$ Thousand)
Period Items 2003 2002 Changes %
March Invoice amount 7,828,325 4,701,077 3,127,248 66.52%
Jan -March Invoice amount 18,593,984 14,821,963 3,772,021 25.45%
March Net sales 7,056,527 4,548,276 2,508,251 55.15%
Jan -March Net sales 17,898,636 12,158,840 5,739,796 47.21%
6) Funds lent to other parties (NT$ Thousand)
Limit of lending March Bal. as of period end
UMC 30,949,691 0 0
UMC's subsidiaries 1,940,958 -31,908 1,909,050
7) Endorsements and guarantees (NT$ Thousand)
Limit of endorsements March Bal. as of period end
UMC 61,899,383 0 0
UMC's subsidiaries 0 0 0
UMC endorses for subsidiaries 0 0
UMC's subsidiaries endorse for UMC 0 0
UMC endorses for PRC companies 0 0
UMC's subsidiaries endorse for PRC companies 0 0
8) Financial derivatives transactions
a-1 Hedging purpose (for assets/liabilities denominated in foreign currencies)
Underlying assets / liabilities N/A
Financial instruments
Realized profit (loss)
a-2 Hedging purpose (for the position of floating rate liabilities)
Underlying assets / liabilities N/A
Financial instruments
Realized profit (loss)
b Trading purpose : None
Exhibit 99.19
The Board of Directors of the Company decides to issue unsecured corporate bonds
1. Date of the board of directors resolution:2003/04/11
2. Name [__nth issue of (secured, unsecured) corporate bonds of ___ Co.]:
3rd issue of unsecured corporate bonds of United Microelectronics
Corporation
3. Total amount of the issue:$15,000 million NTD.
4. Face value:Initially set as $5 million NTD.
5. Issue price:Par value
6. Issue period:Authorize the Chairman to decide based on the market condition.
7. Issue coupon/interest rate:Authorize the Chairman to decide based on the
market condition.
8. Types, names, monetary amounts of security or collateral and stipulations
thereupon:Not applicable.
9. Use of the funds raised by the offering and utilization plan:Material
Purchasing
10. Underwriting method:Authorize the Chairman to decide based on the market
condition.
11. Trustees for the bonds:Authorize the Chairman to decide based on the market
condition.
12. Underwriter or distributing agent institution:Authorize the Chairman to
decide based on the market condition.
13. Guarantor(s) for the issue:Not applicable.
14. Institution serving as agent for payment of the principal and interest:
Authorize the Chairman to decide based on the market condition.
15. Certifying institution:Authorize the Chairman to decide based on the market
condition.
16. Where convertible into shares, the rules for conversion:Not applicable.
17. Resale conditions:Not applicable.
18. Repurchase conditions:Not applicable.
19. The record date for share conversion, if conversion, exchange, or
subscription rights are attached:Not applicable.
20. Possible dilution of equity, if conversion, exchange, or subscription rights
are attached:Not applicable.
21. Any other matters that need to be specified:After the corporate bond is
approved by SFC of MOF and issued, the Company will authorize the Chairman
to apply the corporate bond for ROC OTC trading on the premise of full
compliance with the related regulations. The Company will make a public
announcement after the terms of the corporate bond are decided.
Exhibit 99.20
United Microelectronics Corporation
For the month of March, 2003
This is to report 1) the trading of directors, supervisors, executive officers
and 10% shareholders of United Microelectronics Corporation ("UMC") (NYSE : UMC)
2) the pledge and clear of pledge of UMC common shares by directors,
supervisors, executive officers and 10% shareholders of UMC 3) the acquisition
assets by UMC 4) the disposition of assets by UMC for the month of March, 2003
9) The trading of directors, supervisors, executive officers and 10%
shareholders
Title Name Number of shares held Number of shares Number of shares Changes
when elected (for held as of held as of
Directors, December 31, 2002 March 31, 2003
Supervisors and
Executive Officers)
or as May 30, 2001
N/A N/A
10) The pledge and clear of pledge of UMC common shares by directors,
supervisors, executive officers and 10% shareholders :
Title Name Number of Number of Changes
shares pledge shares pledge
as of as of
December 31, March 31, 2003
2002
N/A N/A
11) The acquisition assets (NT$ Thousand)
Description of assets March Jan -Mar
Semiconductor Manufacturing Equipment 382,162 1303,929
Fixed assets 403 9,863
12) The disposition of assets (NT$ Thousand)
Description of assets March Jan -Mar
Semiconductor Manufacturing Equipment 485,231 596,851
Fixed assets 0 0