1934 Act Registration No. 1-15128
SECURITIES AND EXCHANGE COMMISSION
Washington, DC 20549
FORM 6-K
REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 OF
THE SECURITIES EXCHANGE ACT OF 1934
Dated July 17, 2003
For the month of June 2003
United Microelectronics Corporation
(Translation of Registrant's Name into English)
No. 3 Li Hsin Road II
Science-Based Industrial Park
Hsinchu, Taiwan, R.O.C.
(Address of Principal Executive Office)
(Indicate by check mark whether the registrant files or will
file annual reports under cover of form 20-F or Form 40-F.)
Form 20-F x Form 40-F ________
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(Indicate by check mark whether the registrant by furnishing the
information contained in this form is also thereby furnishing the information to
the Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of
1934.)
Yes ________ No x
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(If "Yes" is marked, indicated below the file number assigned to the
registrant in connection with Rule 12g3-2(b): Not applicable )
SIGNATURE
Pursuant to the requirements of the Securities Exchange Act of 1934, the
registrant has duly caused this report to be signed on its behalf by the
undersigned, thereunto duly authorized.
United Microelectronics Corporation
Date: 7/17/2003 By /s/ Stan Hung
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Stan Hung
Chief Financial Officer
Exhibit
Exhibit Description
99.1 Announcement on June 23, 2003: The Board of Directors Approved a
resolution on the Issuance of 2nd Overseas Exchangeable Bonds
99.2 Announcement on July 3, 2003: UMC and HBA Achieve Working 90-nanometer
Silicon for HBA's High Speed SRAM
99.3 Announcement on July 7, 2003: SUPERH SH4-202 CPU CORE ACHIEVES SILVER
IP STATUS AT UMC
99.4 Announcement on July 9, 2003: June sales
99.5 Announcement on July 15, 2003: 1) the trading and pledge of UMC common
shares by directors, supervisors, executive officers and 10%
shareholders of UMC 2) the acquisition and disposition of assets by UMC
EXHIBIT 99.1
The Board of Directors Approved a resolution on the Issuance of 2nd Overseas
Exchangable Bonds
1. Date of the board of directors resolution:2003/06/20
2. Name [_____nth issue of (secured, unsecured) corporate bonds of ___ Co.]:
2nd issue of overseas exchangeable bonds of United Microelectronics Corp.
3. Total amount of the issue: no more than US$212million
4. Face value: US$10,000 each or greater
5. Issue price: 101%-108% of par value
6. Issue period: five years
7. Issue coupon/interest rate: authorize the Chairman to decide based on the
market condition
8. Types, names, monetary amounts of security or collateral and stipulations
thereupon: not applicable
9. Use of the funds raised by the offering and utilization plan:
use for overseas material purchase
10. Underwriting method: authorize the Chairman to decide based on the
market condition
11. Trustees for the bonds: authorize the Chairman to decide based on the
market condition
12. Underwriter or distributing agent institution: authorize the Chairman to
decide based on the market condition
13. Guarantor(s) for the issue: not applicable
14. Institution serving as agent for payment of the principal and interest:
authorize the Chairman to decide based on the market condition
15. Certifying institution: authorize the Chairman to decide based on the
market condition
16. Where convertible into shares, the rules for conversion: authorize the
Chairman to decide based on the market condition
17. Resale conditions: authorize the Chairman to decide based on the
market condition
18. Repurchase conditions: authorize the Chairman to decide based on the
market condition
19. The record date for share conversion, if conversion, exchange, or
subscription rights are attached: not applicable
20. Possible dilution of equity, if conversion, exchange, or subscription
rights are attached: not applicable
21. Any other matters that need to be specified: The exchangeable bonds
is subjected to SFC of MOF's approval. Additional announcement will be
made thereafter when terms and conditions are finalized.
EXHIBIT 99.2
UMC and HBA Achieve Working 90-nanometer Silicon for HBA's High Speed SRAM
1.Date of occurrence of the event: 2003/07/02
2.Cause of occurrence: Hsinchu, July 2, 2003--UMC, a world leading semiconductor
foundry (NYSE: UMC) and High Bandwidth Access, Inc. (HBA), developer of advanced
FIFO and specialty memory devices for high capacity broadband networks, today
announced the successful prototyping of HBA's high speed IC based on the
foundry's 90-nm process. The two engineering teams achieved working silicon on
their first pass, signifying the close collaboration between the companies to
successfully integrate HBA's design with UMC's most advanced process. Volume
production for HBA's IC is expected later this year. UMC's 90-nm HS (High speed)
process enables the SRAM prototype to deliver extremely high performance while
maintaining a low operational current and a core voltage range of 0.8V-1.4V. The
IC paves the way for future SoC integration and is suited for HBA's new high
density ZeBL (Zero Bus Latency) SRAM family. In addition, the two companies have
validated key analog and digital IPs for UMC's 90-nm process.
3. Countermeasures: none
4. Any other matters that need to be specified: none
EXHIBIT 99.3
SUPERH SH4-202 CPU CORE ACHIEVES SILVER IP STATUS AT UMC
1.Date of occurrence of the event: 2003/07/07
2.Cause of occurrence: Hsinchu, Taiwan; San Jose, USA; Bristol, UK and Tokyo,
Japan - 7 July, 2003 UMC (NYSE: UMC) a world leading semiconductor foundry, and
SuperH, Inc., the leading supplier of multimedia RISC CPU cores, today announced
that SuperH's SH4-202 32-bit CPU core has achieved "Silver IP" status at UMC for
the foundry's 0.13um process. A Silver ranking under UMC's Gold IP program
signifies that the core has been verified in silicon at UMC and is ready for
production.
The SH-4 family is targeted at a wide range of multimedia applications including
set top box, car information systems and portable digital consumer products and
is supported through SuperH's extensive 3rd party program with over 65 companies
offering various development tools, software and design services.
The "Silver IP" status of the SH4-202 will become "Gold IP" once a customer
design that uses the core achieves volume production at UMC. The Gold IP program
makes available to customers a wide range of silicon verified IP and library
components that are optimized for easy integration into customer designs.
The SH4-202 CPU core integrates a 32-bit RISC CPU core with an integrated Vector
floating point unit and delivers an impressive 1.5Dhrystone 2.1 MIPS/MHz and
7MFLOPS/MHz. In 0.13um CMOS the CPU core is less than 1mm2 and the whole hard
macro integrating CPU, FPU, 32K D cache, 16K I cache, serial port, timers, real
time clock, interrupt controller, bus interface and debug port is only 8.2mm2.
3. Countermeasures:none
4. Any other matters that need to be specified: none
EXHIBIT 99.4
United Microelectronics Corporation
July 9, 2003
This is to report the changes or status of 1) Sales volume 2) Funds lent to
other parties 3) Endorsements and guarantees 4) Financial derivative
transactions for the period of June 2003
1) Sales volume (NT$ Thousand)
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Period Items 2003 2002 Changes %
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June Invoice amount 7,555,783 6,654,217 901,566 13.55%
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Jan -June Invoice amount 41,341,175 33,937,025 7,404,150 21.82%
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June Net sales 7,027,757 6,711,096 316,661 4.72%
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Jan -June Net sales 39,604,152 30,739,328 8,864,824 28.84%
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2) Funds lent to other parties (NT$ Thousand)
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Balance as of period end
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This Month Last Month Limit of lending
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UMC 0 0 30,949,691
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UMC's subsidiaries 30,810 30,367 1,940,958
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3) Endorsements and guarantees (NT$ Thousand)
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Change in This Month Balance as of period end Limit of endorsements
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UMC 0 0 61,899,383
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UMC's subsidiaries 0 0 0
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UMC endorses for subsidiaries 0 0
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UMC's subsidiaries endorse for UMC 0 0
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UMC endorses for PRC companies 0 0
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UMC's subsidiaries endorse for PRC companies 0 0
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4) Financial derivatives transactions
a-1 Hedging purpose (for assets/liabilities denominated in foreign currencies)
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Underlying assets / liabilities N/A
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Financial instruments
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Realized profit (loss)
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a-2 Hedging purpose (for the position of floating rate liabilities)
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Underlying assets / liabilities N/A
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Financial instruments
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Realized profit (loss)
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b Trading purpose : None
EXHIBIT 99.5
United Microelectronics Corporation
For the month of June, 2003
This is to report 1) the trading of directors, supervisors, executive officers
and 10% shareholders of United Microelectronics Corporation ("UMC") (NYSE : UMC)
2) the pledge and clear of pledge of UMC common shares by directors,
supervisors, executive officers and 10% shareholders of UMC 3) the acquisition
assets by UMC 4) the disposition of assets by UMC for the month of June, 2003
1) The trading of directors, supervisors, executive officers and 10%
shareholders
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Title Name Number of shares held Number of shares Number of shares Changes
when elected (for held as of held as of
Directors, May 31, 2003 June 30, 2003
Supervisors and
Executive Officers)
or as May 30, 2001
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CMO Chris Chi 3,385,640 3,277,640 108,000
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President Fu-Tai Liou 5,582,601 5,492,301 90,000
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2) The pledge and clear of pledge of UMC common shares by directors,
supervisors, executive officers and 10% shareholders :
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Title Name Number of Number of Changes
shares pledge shares pledge
as of as of
May 31, 2003 June 30, 2003
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N/a N/a
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3) The acquisition assets (NT$ Thousand)
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Description of assets June Jan - Jun
--------------------------------------------------------------------------------------------
Semiconductor Manufacturing Equipment 392,372 3,312,540
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Fixed assets 2,132 38,434
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4) The disposition of assets (NT$ Thousand)
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Description of assets June Jan - Jun
--------------------------------------------------------------------------------------------
Semiconductor Manufacturing Equipment 125,216 993,272
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Fixed assets 0 18,283
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